Izdelki za hdpe hrana varna (3)

Wafer carriers are used to store transfer transport and protect wafers - There are many types of wafer carriers, and each has its own application. For example, the front-opening wafer transfer box FOUP can be used in the semiconductor process in the manufacturing plant, the front-opening wafer transport box FOSB can be used for transportation between manufacturing plants, and the wafer flower basket can be used. for wafer cleaning, etc. Fluororesin has an extremely stable molecular structure, so it is hardly affected by light, temperature and chemicals, and is the "king of resins" that subverts the inherent concept. In the process of cleaning chips, high-purity chemicals are required, and fluoropolymers are the only materials that can contain and transport the high-purity chemicals used in the manufacturing process, achieving the extremely high stability and purity required for semiconductor manufacturing.

Les avantages obtenus par le thermoscellage par induction dans un processus de scellage sans bouchon Enercon peut désormais offrir un scellage performant sur des récipients, aussi bien sans bouchon et sans bouchon à vis, qu’avec des bouchons à clipser grâce à une scelleuse à pression intégrant la thermoscelleuse Super Seal ™. Le récipient bouché est ensuite guidé à travers le tunnel de scellage par induction, où une pression est appliquée sur le bouchon clipsé ou sur l’opercule via une courroie de recirculation non métallique. Cette conception unique prend automatiquement en compte les variations et les tolérances des composants, tels que la variation de hauteur des récipients, le débordement des produits, la variation de la vitesse de la ligne et le centrage des bouteilles. La pression est maintenue durant et après le processus de thermoscellage par induction. La vitesse de fonctionnement:Jusqu’à 40 Mètres par minute Diamètre d'étanchéité:jusqu’à 110mm de diamètre

The benefits of induction technology in a capless sealing process. Successful sealing on both capless and non-screw-cap containers such as snap on caps is now possible with a pressure Sealer incorporating an Enercon Super Seal™ unit. Typically, pressure belt sealing is used to replace conduction sealing or to reduce the dwell-time needed in conduction sealing. Seals are either placed onto the capless containers or reside in the cap as inserted by the cap manufacturer. The capped container is then guided through the induction heating tunnel, where downward pressure is applied to the clip-on cap or foil by a non-metallic recirculating belt. This unique design automatically takes account of component variations and tolerances, such as bottle height variation, product overfill, line speed variation and bottle centres. Incorporates an Enercon Super Seal™ unit • Cap sizes up to 110mm diameter • Conveyor Speed up to 40 metres / minute